StarTech.com Thermal CPU Paste Compound 1.93 W/m·K SILVGREASE1
The StarTech.com SILVGREASE1 Thermal CPU Paste Compound is engineered to enhance heat dissipation from integrated computer chips, featuring a thermal conductivity of 1.93 W/m·K to ensure system stability and extend hardware longevity.
- Optimized Heat Transfer: With a thermal conductivity of 1.93 W/m·K, this paste efficiently moves heat away from CPUs, preventing thermal throttling and maintaining peak performance.
- System Stability: By ensuring effective heat dissipation, it minimizes the risk of overheating-related crashes, safeguarding critical business operations and data integrity.
- Extended Hardware Lifespan: Reducing operating temperatures for components like CPUs helps to significantly prolong their operational life, deferring costly hardware replacements.
- RoHS Certified: Compliance with RoHS standards ensures the product is free from hazardous substances, meeting environmental regulations for responsible IT procurement.
Product Overview
Product Overview
The StarTech.com SILVGREASE1 Thermal CPU Paste Compound is a metal-based solution designed to improve heat transfer between a CPU and its heatsink, featuring a thermal conductivity of 1.93 W/m·K and a specific gravity of 1.7 g/cm³. This compound is supplied in a re-sealable syringe for precise application and minimal waste.
Engineered for reliable performance in demanding IT environments, this thermal paste operates across a wide temperature range of -30 to 180 °C and boasts low evaporation and bleed rates, ensuring long-term stability and consistent thermal performance for critical servers and workstations.
- Core Functionality: Enhanced Thermal Conductivity: With 1.93 W/m·K thermal conductivity, this paste maximizes heat transfer from CPUs, preventing performance degradation and ensuring consistent processing power for business applications.
- Reliable System Operation: Its metal-oxide composition and stable thermal resistance of 0.12 °C/W ensure efficient heat dissipation, reducing the risk of system crashes and unexpected downtime in busy office environments.
- Wide Operating Temperature Range: Designed to perform reliably from -30 to 180 °C, this compound maintains its integrity under varied environmental conditions, supporting diverse IT deployments from server rooms to industrial settings.
- Long-Term Stability: Featuring extremely low evaporation (0.001% @ 200°C/24h) and bleed (0.05% @ 200°C/24h) rates, the paste maintains its thermal properties over time, reducing the need for frequent reapplication and maintenance.
- Operational Value: Hardware Longevity: By effectively managing CPU temperatures, this thermal paste extends the operational lifespan of expensive processors and motherboards, contributing to a lower total cost of ownership for IT assets.
Deploy this thermal paste to safeguard your IT investments, ensuring optimal performance and extended reliability for all critical computing hardware.
Technical Specifications
1Performance & Business Impact
3Physical & Environmental
4Lifecycle, Warranty & Compliance
Full Specifications
Features6
Weight & dimensions3
Technical details1
Packaging data1
Logistics data1
What This Solves
Preventing Server Overheating
Server rooms often experience high heat loads, which can lead to CPU throttling and system crashes if not properly managed. This thermal paste ensures maximum heat transfer from server processors to heatsinks, maintaining optimal operating temperatures for continuous service.
Data center operators, enterprise infrastructure teams, organizations with on-premise servers
Extending Workstation Lifespan
High-performance workstations used for CAD, video editing, or data analysis generate significant heat, potentially shortening component life. Applying this thermal compound improves heat dissipation, protecting expensive CPUs and motherboards from thermal degradation and extending their operational lifespan.
Engineering firms, creative agencies, financial analysts, scientific research labs
Routine IT Hardware Maintenance
Regular maintenance of IT equipment, including cleaning and re-pasting CPUs, is crucial for long-term reliability and performance. This re-sealable syringe of thermal paste provides IT departments with a cost-effective solution for routine thermal management during hardware upgrades or repairs.
Small businesses without dedicated IT, growing mid-market companies, internal IT operations teams
Key Features
Thermal Conductivity: 1.93 W/m·K
This high thermal conductivity ensures efficient heat transfer from critical components, preventing performance bottlenecks and maintaining system responsiveness.
Metal Oxide Compound (60% metal oxide)
The metal-based composition provides superior heat transfer capabilities compared to standard compounds, enhancing the stability of high-performance processors.
Operating Temperature Range: -30 to 180 °C
This wide temperature tolerance guarantees reliable performance in diverse environmental conditions, from cold server rooms to warmer industrial settings.
Low Evaporation (0.001% @ 200°C/24h)
Minimal evaporation ensures the thermal paste maintains its effectiveness over extended periods, reducing the need for frequent reapplication and maintenance.
RoHS Compliance
Adherence to RoHS standards confirms the product is free from hazardous substances, supporting environmentally responsible IT procurement and compliance initiatives.
Industry Applications
Manufacturing & Industrial
Ensures thermal stability for industrial control systems and ruggedized PCs, preventing overheating in demanding production environments.
Healthcare & Life Sciences
Maintains reliable operation of diagnostic workstations and lab equipment by preventing CPU overheating, crucial for data integrity and uptime.
Finance & Insurance
Supports the consistent performance of high-frequency trading terminals and data analytics servers, where thermal stability is paramount for continuous operation.
Legal & Professional Services
Extends the lifespan and ensures the stability of high-performance workstations used for complex legal research and data processing, minimizing disruptions.
Frequently Asked Questions
How much thermal paste is included in the syringe?
The StarTech.com SILVGREASE1 syringe contains 4 grams of thermal paste, which is sufficient for multiple CPU applications depending on the processor size.
Is this thermal paste electrically conductive?
No, this thermal paste is a metal-oxide compound designed for thermal conductivity, not electrical conductivity, ensuring safety when applied near electrical components.
What is the recommended application method for this thermal paste?
For optimal results, apply a small pea-sized dot to the center of the CPU's integrated heat spreader, then gently place the heatsink on top to spread the paste evenly.
Can this thermal paste be used on GPUs or other chipsets?
Yes, while primarily designed for CPUs, this thermal paste can also be effectively used on GPUs, chipsets, and other integrated circuits requiring improved heat dissipation.
Warranty & Returns
Manufacturer Warranty
2 Years
Warranty is provided directly by the manufacturer and covers defects in materials and workmanship under normal use.
Return Policy
Returns subject to manufacturer approval
Hardware returns are governed by the manufacturer's return policy. Some products are non-returnable or subject to restocking fees. Defective items are handled under the manufacturer warranty. Contact Zent Networks before initiating any return.